EMS & SUBCON

Operation
  • 10 Lines/120 Operators
  • (Base on 24hrs.)
  • 500-1,000 Kpcs./month

Capacity

  • Placement component 190 Million shots a month.

Machine VS Brand

  • FUJI NXT III / 2Line
  • PANASONICS / 5Line
  • YAMAHA YS24 / 3Line

MACHINE CONFIGURATION

Full automatic Solder Paste Printer : 9 LINE
PANASONIC SPV-DC ( DUAL-LANE) FULL AUTOMATIC SOLDER REFILL1 Unit
PANASONIC SPG1 Unit
 GKG-G53 Unit
 FUJI GPX-HD2 Unit
GKG-G5 3 Unit
PDT-PS10001 Unit
Dek HORIZON 02i1 Unit
Automatic 3D Solder paste inspection ( In-Line ) : 4 LINE
KOH YOUNG KY8032-23 Unit
Pemtron 5700HL1 Unit
Glue Dispenser : 3 LINE
JET–Dispenser ( D-Sniper )1 Unit
PANASONIC HDPG12 Unit
High Speed mounted (Multifunction) : 9 LINE
FUJI NXT-III 9 Modula
PANASONIC NPM-W2 ( Dual-Lan system)3 Modula
PANASONIC NPM-W2 Modula
PANASONIC NPMD1 Modula
PANASONIC NPM-TT (Direct tray)1 Modula
PANASONIC CM602 (Direct tray)3 Modula
PANASONIC CM401-A1 Modula
PANASONIC CM101-D2 Modula
PANASONIC CM212-M (Direct tray)2 Modula
PANASONIC CM402-A2 Modula
YAMAHA YS243 Modula
YAMAHA YV100xg (Direct tray)1 Modula
Reflow oven (LF support) : 9 LINE 
Heller 1809 EXL (9 Zone)2 Unit
Heller 1812 EXL (12 Zone)2 Unit
Vitronic MR933 (CBS)2 Unit
JTU (CBS)2 Unit
BTU Paramax1 Unit
2D Auto optical inspection After reflow (AOI) : 9 LINE
SAKI PLANET-II1 Unit
SAKI BF18-MVT1 Unit
SAKI COMET183 Unit
SAKI BF18-DS1 Unit
SAKI BF18D-N401 Unit
SAKI BF9812 Unit
3D Auto optical inspection After reflow (AOI) : 2 Unit
Zenith DL, KOH YOUNG 3D Automated Optical Inspection System1 Unit
SAKI 3DI Automated Optical Inspection System1 Unit
X-RAY Machine : 1 Unit
Unicomp Semi-Auto X-ray inspection system with Auto program system1 Unit


SMT Machine Option system

  • APC system (Advance Process control system)
  • PanaCIM component verification
  • FUJI TRAX component verification
  • Automatic Model change over
  • KOH YONG KSMART SYSTEM (REVIEW SPI & AOI)
  • SPC Review For SPI & AOI (CPK CHECKING)
  • SAKI - BF SERVER (SAKI AOI Inspection Data record)
  • PRODUCTION LINE MORNITOR
  • SHOP FLOOR CONTROL SYSTEM

PROCESS CAPABILITY

  • Lead Free Soldering
  • Halogen Free PW
  • Board Size: 50x50 to 510x460 mm.
  • Chip size 0603 mm. (0201”)
  • Chip size 1005(0402”)
  • QFN, QFP Find Pitch 0.4 mm.
  • BGA / µBGA.
SMT Assembly Production Management Process
 
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